Interconnect New Product Introduction (NPI)

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The rapidly growing demand for bandwidth in datacom applications has driven the evolution of pluggable I/O interfaces, which provide more data throughput in smaller packages. The pluggable I/O interface offers significant advantages as a high-speed I/O interconnect in networking, storage and telecom applications. It features a standard equipment I/O interface that supports both fiber and copper links. With the flexibility of pluggable modules and cabling, it supports various data rates and protocols such as Ethernet, Fibre Channel and InfiniBand. As a result, with standard equipment platforms, the integrator can design the cabling structure based on the application needs. The full line of Tyco Electronics’ pluggable I/O interfaces:

SFP

• From the original 20 position pluggable transceiver (PT) connector and single port cage, the product line has expanded rapidly to include many other options to increase functionality
• Options include higher density multiport SFP cages in single row and stacked configurations, and integrated light pipes for port indicators, connectors with improved signal integrity, enhanced EMI springs for increased EMI suppression and riding heat sink technology for thermal management
• Ideal for switches, routers, servers, hubs, storage, controllers and Network Interface Cards (NICs)

SFP+

• Backward compatible with SFP
• Supports applications up to 10Gb/s
• Cages offered in single port, ganged and stacked configurations
• Elastomeric gaskets and springs for EMI containment
• Uses enhanced 20 position connector
• Heat sink optional for single port cages
• Cages accommodate belly-to-belly mounting
• Enables hardware OEMs and data center operators to achieve high port density and configurability at a low cost and reduced power requirement

Quad Small-Form Factor Pluggable (QSFP)

• Developed for additional density, providing a 4-channel 40 Gb/s (4x10Gb/s) pluggable interface
• Each channel capable of transferring data at 10 Gb/s and supports a total of 40 Gb/s
• Three times the density of SFP+ interconnects
• Includes cages in single and ganged configurations with various heat sink and lightpipe options
• Connector is a 38-position high-speed SMT connector, and EMI plugs are offered for empty ports
• Enables hardware OEMs and data center operators to achieve higher port density and configurability at a low cost while reducing the power requirement
• Form factor utilizes 8 differential pairs, which provide 4 data transmission channels

XFP

• Supports 10 Gb/s links
• Challenges in signal integrity and EMI were addressed through low-loss connector construction and the introduction of conductive gaskets
• Riding heatsink technology was introduced by Tyco Electronics for thermal management

CFP

• New interface designed for 40 and 100 G Ethernet, providing 10 channels at up to 10 Gb/s each, and primarily supporting optical long reach applications
• CFP-compliant products including module and host board connectors and related mechanical components

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